Site Map


About TIAX

  • Overview
  • Business Model
  • Laboratories & Tools
  • Technology Insourcing
  • Technology Markets
  • News & Events
  • Publications & Reports

Technology Platforms

  • Energy Usage Efficiency
  • Energy Storage
  • Energy Generation
  • Defense and Homeland Security

Technology Services

  • Advanced Battery Technologies
  • Building Systems & Efficiency
  • Clean Energy & Transportation
  • Materials & Chemicals
  • Defense and Homeland Security

Careers at TIAX

  • Working at TIAX
  • Current Job Opportunities

Contact Us

  • Contacts
  • Directions
  • Home
  • >Materials & Chemicals
  • > Solid Oxide Fuel Cells Interconnect Materials

Picture

Main

Solid Oxide Fuel Cells Interconnect Materials

Solid Oxide Fuel Cells (SOFC) offers the prospect of clean, efficient, and quiet power across a wide range of system capacities, from a few hundred watts to multi-megawatts. And, because SOFCs can operate on a variety of currently available fossil fuels, they could be rolled out rapidly within the existing global fuel infrastructure.

Despite their significant promise, however, SOFCs have yet to meet the performance, durability, and cost targets needed to achieve commercial viability. To address these issues, developers have been focusing on problems at the stack level, such as low-power density that degrades over time, sealing issues that limit operating cycles, and impractical start-up times. At the source of these challenges-and therefore a critical barrier to SOFC commercialization-is the metal alloy interconnect used in fuel cell stacks.

TIAX has developed patent-pending interconnect materials that solve these major problems and enable the development of robust and reliable stacks and viable SOFC systems to meet market needs. TIAX's new metal matrix composite (MMC) interconnect materials combine the best properties of metal and ceramic components to offer unique and valuable thermo-mechanical-chemical properties. The TIAX interconnects solve the following critical limitations currently facing SOFC systems:


Current SOFC Limitiations TIAX Interconnect Solution
Limited operating life due to poor stack reliability and performance
  • Absence of chrome eliminates cathode poisoning
  • Slow growing oxide scale with high electrical conductivity maintains low contact resistance
Limited operating cycle (on/off operation) due to stack sealing issues
  • Stack sealing can be more easily achieved by precise matching of thermal expansion coefficient to cell components
Long start-up times due to thermal stresses
  • High thermal conductivity smoothes temperature gradients and reduces thermal stresses
High Cost due to low power density
  • Precise matching of thermal expansion coefficient allows bonding of interconnect to electrodes producing low contact resistance
  • High thermal conductivity results in high power density
For more information contact Michael Kretsch via email or by phone at 781-879-1298

©2010 TIAX LLC